Tiny PICs with Huge Impact: Meeting the Challenges of Photonic Integrated Circuits testing for next-generation networks
Optical testing at the wafer level is currently a major bottleneck in component manufacturing due to tighter tolerances in optical testing compared to electrical testing, accounting for 80 percent of the test and assembly cost of the final product.
Three industry innovators - EXFO, Hewlett Packard Enterprise (HPE) and MPI Corporation – have combined forces to address the challenges posed by optical component testing with advanced, interoperable measurement techniques.
In this webinar, you will discover how the collaborative EXFO, HPE, and MPI PIC testing solution addresses market challenges, making wafer testing faster, scalable, and more reliable, ultimately improving speed-to-market for component manufacturers. This topic shines a light on photonic wafers as critical building blocks for next-generation networks, laying the groundwork for 5G deployment and high-speed data centers.
Three industry innovators - EXFO, Hewlett Packard Enterprise (HPE) and MPI Corporation – have combined forces to address the challenges posed by optical component testing with advanced, interoperable measurement techniques.
In this webinar, you will discover how the collaborative EXFO, HPE, and MPI PIC testing solution addresses market challenges, making wafer testing faster, scalable, and more reliable, ultimately improving speed-to-market for component manufacturers. This topic shines a light on photonic wafers as critical building blocks for next-generation networks, laying the groundwork for 5G deployment and high-speed data centers.